Applied Materials, Inc. engages in the development, manufacture, marketing, and service of fabrication equipment for the worldwide semiconductor and semiconductor-related industries. Customers for these products include manufacturers of semiconductor chips and wafers, flat panel displays, and other electronic devices such as solar photovoltaic (PV) cells.
Segments
The company conducts its operations through four segments: Silicon, Fab Solutions, Display, and Adjacent Technologies.
SILICON SEGMENT
The company's Silicon segment comprises a range of manufacturing equipment used to fabricate semiconductor chips. It offers systems that perform most of the primary steps in the chip fabrication process, including: atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical plating (ECP), etch, ion implantation, rapid thermal processing (RTP), chemical mechanical planarization (CMP), wafer wet cleaning, wafer metrology and inspection, and systems that etch, measure and inspect circuit patterns on masks used in the photolithography process. The company offers a range of systems and, through its Fab Solutions segment, products and services to support 200mm and 300mm wafer processing.
Applied Producer Black Diamond system in volume production: Applied’s second-generation system for low k dielectric film, the Applied Producer Black Diamond II, further reduces the dielectric constant to increase the speed of customers’ chip designs.
The company's products are single-wafer systems with multiple process chambers attached to a base platform. Each wafer is processed separately in its own environment, allowing precise process control, while the system’s multiple chambers enable simultaneous, high productivity manufacturing. The company sells most of its single-wafer, multi-chamber systems on four basic platforms: the Centura, the Endura, the Producer, and the Vantage. These platforms support ALD, CVD, PVD, etch and RTP technologies.
Deposition
The company provides equipment to perform the four main types of deposition: ALD, CVD, PVD and ECP. In addition, Applied’s RTP systems can be used to perform certain types of dielectric deposition.
Atomic Layer Deposition: The company offers ALD chambers for depositing tungsten and tantalum nitride films. The Applied Endura iCuBS product is the industry’s first system to integrate ALD and PVD chambers on a single platform for depositing critical barrier and seed layers in copper interconnects. The Applied Centura iSprint Tungsten system (iSprint) combines an ALD chamber, which deposits a tungsten nucleation film, with a CVD tungsten bulk fill process in one system. The iSprint is used to form contact structures that connect the transistors to the wiring areas of the chip.
Chemical Vapor Deposition: CVD is used by customers to deposit dielectric and metal films on a wafer. The company offers the following CVD products and technologies: The Applied Producer CVD system, The Applied Centura Ultima HDP-CVD system, Low k Dielectric Films, Epitaxial Deposition, Polysilicon Deposition, Silicon Nitride Deposition, Aluminum Deposition, and Tungsten Deposition.
The Applied Producer CVD system: This high-throughput platform features Twin-Chamber modules that have two single-wafer process chambers per unit. Up to three Twin-Chamber modules can be mounted on each Producer platform, giving it a simultaneous processing capacity of six wafers.
The Applied Centura Ultima HDP-CVD system: High-density plasma CVD (HDP-CVD) is used to fill very small, deep spaces (gap-fill) with dielectric film. This product is used by a number of major integrated circuit manufacturers for gap-fill applications, including the deposition of silicon oxides in substrate isolation structures, contacts and interconnects.
Low k Dielectric Films: The Applied Producer Black Diamond CVD low k system is being used by several customers in volume production to produce some of the industry’s most advanced devices. The Applied Producer Black Diamond II is a second-generation dielectric that provides a lower k-value film for building faster 65 nanometer (nm) generation and below chip designs. A complementary low k dielectric, called the Applied Producer BLOk (Barrier low k), enables the complete, multi-layer dielectric structure to benefit from low k technology.
Epitaxial Deposition: Epitaxial silicon (epitaxy or epi) is a layer of pure silicon grown in a uniform crystalline structure on the wafer to form a high quality base for the device circuitry. The Applied Centura Epi system integrates pre- and post-epi processes on the same system to improve film quality and reduce production costs.
Polysilicon Deposition: Polysilicon is a type of silicon used to form portions of the transistor structure within the integrated circuit device. The Applied Centura Polygen LPCVD (low pressure chemical vapor deposition) system is a single-wafer, multi-chamber product that deposits thin, polysilicon films at high temperatures to create transistor gate structures. The Applied Centura DPN Gate Stack system integrates chambers for decoupled plasma nitridation (DPN), RTP anneal and polysilicon deposition on one platform to enable superior film quality and material properties.
Silicon Nitride Deposition: The Applied Centura SiNgen Plus LPCVD system is a single-wafer, high-temperature system that deposits silicon nitride films for transistor applications.
Aluminum Deposition: In 2006, the Company introduced its Applied CVD Al (aluminum) process technology for building high-density interconnects in Flash and DRAM memory chips.
Tungsten Deposition: The Company has two products for depositing tungsten: the Applied Centura Sprint Tungsten CVD system for 90nm and below devices and the Applied Centura iSprint ALD/CVD system for other applications. The latter product combines ALD technology and CVD chambers on the same platform.
Physical Vapor Deposition: This system offers a range of advanced deposition processes, including aluminum, aluminum alloys, cobalt, titanium/titanium nitride, tantalum/tantalum nitride, tungsten/tungsten nitride, nickel, vanadium and copper (Cu). The Applied Endura CuBS (copper barrier/seed) PVD system is used by customers for fabricating copper-based chips.
Electrochemical Plating: The Applied SlimCell ECP (electrochemical plating) system offers a small-volume cell design that enables a reduction in defect levels compared to conventional systems while reducing chemical consumption.
Etch
For dielectric applications, the Applied Centura eMax system etches a range of dielectric films in the contact and interconnect regions of the chip. The company's Producer Etch system utilizes the Company’s Twin-Chamber Producer platform concept to target dielectric etch applications in 90nm and below design geometries. To address low k etch applications, the Applied Centura Enabler Etch system performs etch, strip and clean steps in a single chamber.
The Applied Centura AdvantEdge Silicon Etch system offers chipmakers high precision gate etching for 65nm and 45nm-generation devices. For etching metals, the company launched the Applied Centura AdvantEdge Metal Etch system in 2006.
Ion Implantation
The Applied Quantum X Plus Implant system provides chipmakers with a production-worthy, single-wafer, high-current implanter that enables transistor scaling beyond the 45nm node. The Quantum X Plus system’s fixed beam and precision mechanical scanning system provide precise energy control and low defect levels to deliver the process technology needed to achieve the most difficult and critical implants.
Rapid Thermal Processing
The Applied Centura Radiance Plus and Applied Vantage RadiancePlus RTP systems feature the same RTP technology with differing platform designs. While the multi-chamber Centura platform offers exceptional process flexibility, the streamlined two-chamber Vantage platform is designed for dedicated high-volume manufacturing. For flash memory applications, the Applied Vantage RadOx system deposits transistor gate oxides.
Chemical Mechanical Planarization
The Company’s 200mm Applied Mirra Mesa systems and 300mm Applied Reflexion systems. The Company’s 300mm Applied Reflexion LK Ecmp system features proprietary electrochemical mechanical planarization technology to provide an extendible solution for copper/low k interconnects at the 65nm node and below.
Metrology and Wafer Inspection
The company offers different types of products that are used to measure and inspect the wafer during various stages of the fabrication process: Critical Dimension and Defect Review Scanning Electron Microscopes (CD-SEMs and DR-SEMs) and Wafer Inspection.
CD-SEMs and DR-SEMs: Scanning electron microscopes (SEMs) use an electron beam to form images of microscopic features, or critical dimensions (CDs), of a patterned wafer at extremely high magnification. The company's SEM products or systems provide customers with full automation, along with the high accuracy and sensitivity needed for measuring very small CDs. The Applied VeritySEM Metrology system uses proprietary SEM imaging technology to enable precise control of the lithography and etching processes. The VeritySEM measures CDs with less than 5 angstrom precision and incorporates automation and software advancements for significantly higher throughput in production. The Company’s OPC Check software for the VeritySEM system performs automated qualification of OPC-based (optical proximity correction) chip designs, significantly reducing mask verification time over conventional manual methods. DR-SEMs review defects on the wafer (such as particles, scratches or residues) that are first located by a defect detection system and then classify the defects to identify their source.
Wafer Inspection: The Applied ComPlus 3T Inspection system, for darkfield applications, detects defects in devices with design rules of 65nm and below with the high speed required for customers’ volume production lines. The Applied UVision Inspection system is a laser-based 3D brightfield tool.
Mask Making
The company provides systems for etching, measuring and inspecting masks. The Applied Tetra II Mask etch system is based on the Company’s production-proven decoupled plasma source (DPS) wafer etch technology and is the semiconductor etch tool for fabricating masks. The Applied RETicle SEM system, built on Applied’s CD-SEM platform, measures virtually all mask types with sub-1nm precision.
FAB SOLUTIONS SEGMENT
Through its Fab Solutions segment, the company provides products and services designed to improve the performance and productivity of semiconductor manufacturers’ fab operations. The company offers a range of products to maintain, service and optimize the operations of customers’ fabs. Applied Materials Genuine Parts include spare parts manufactured to Applied’s strict technical specifications and quality standards. Applied Certified Service Products provides customers with optimized tool performance for improved total cost of ownership and a higher return on investment. The company also offers remanufactured equipment, product enhancements and technical training for customers.
As part of its eService Solutions, Applied offers FAB300, a manufacturing execution system (MES), to monitor and control fab manufacturing activities. This system is used in semiconductor fabs, test, assembly and packaging facilities, and flat panel display (FPD) manufacturing facilities. The company also offers a suite of diagnostic software that links hardware, process and service data from different processing systems throughout the fab. The Applied NeXus SPC product is a new diagnostic tool that performs split-second analysis of process conditions in Applied’s processing systems.
Metron Technology, Inc. (Metron), a wholly-owned subsidiary of Applied Materials, offers a range of products and services for fab operations support. Metron’s products include fab and sub-fab systems, wafer management services, chamber performance services, gas and fluid handling components, and other services that are critical to semiconductor manufacturing. With Metron’s acquisition of ChemTrace in 2006, Metron offers chipmakers a range of services to analyze and identify the sources of surface or airborne contamination. Metron also offers EcoSys treatment systems to address a range of semiconductor abatement applications.
DISPLAY SEGMENT
The company also manufactures and services equipment to fabricate flat panel displays (FPDs). These systems are used by FPD manufacturers to build and test thin-film transistor liquid crystal display (TFT-LCD) panels for televisions, computer displays and other consumer-oriented electronic applications. It supplies a range of systems that process and test many different panel sizes.
The AKT-55K PECVD (plasma-enhanced CVD) system, used for fabricating the transistor layer of Gen-8.5 panels, features Applied’s multi-chamber platform architecture. For fabricating the color filter layer of these panels, the company offers a vertical sputtering system, the AKT-NEW ARISTO 2200. The company acquired the NEW ARISTO technology during 2006 as part of its acquisition of Applied Films Corporation (Applied Films).
Complementing these systems, the company also offers electron beam systems for testing substrates during production for defective pixels and other imperfections. The electron beam system’s non-contact test technology enables safe testing of high-value LCD TV panels without damaging or scratching the display.
ADJACENT TECHNOLOGIES SEGMENT
In the solar PV area, the company offers a suite of manufacturing systems to enable customers to increase the conversion efficiency and yields of their PV devices. These include equipment as well as processes, material-handling technologies and services to support the manufacture of both crystalline-silicon and thin-film silicon solar cells.
The company also provides roll-to-roll vacuum web coating systems for depositing a range of films on flexible substrates for functional, aesthetic or optical properties. The TOPMET system is capable of handling substrates in roll widths from 1.25-4.5m with high throughput and low cost of ownership.
The company offers large-area sputter coating equipment for the production of low-emissivity and solar control architectural glass. The AXL 870 coating system is a tool that customers can reconfigure to produce products to meet the challenges of a changing market.
Sales and Marketing
The company primarily operates in Taiwan; North America; Korea; Japan; Asia-Pacific, including China; and Europe.
Customers
The company's major customer is Samsung Electronics Co., Ltd.
History
Applied Materials, Inc. was founded in 1967.
